3D Solder Paste Inspection

Combination of speed, resolution, repeatability, precision construction and broadest feature bandwidth produces industry leading cycle times.

RSC-7 Sensor

  • Industry leading inspection speed
  • 30% faster than RSC-6
    • SIGMA X Orange : 100cm2/sec @ 10×10μm
    • SIGMA X Blue : 60cm2/sec @ 10×10μm

Optimized Panel Transportation

  • 1,000mm/sec of panel transportation
  • Reduced loading/unloading time
  • 4 seconds faster than HS60

Real 3D Images

PARMI’s inspection technology is unaffected by varying materials, surface conditions or colors. The system profiles the board to generate accurate 3D shapes far superior to other brands and technologies.

Warpage Tracking in Real Time

  • The system identifies total board warpage up to 10mm(±5mm) and the exclusive Z Axis motion control system maintains optimal depth of focus while measuring Warpage.

PCB Warpage Measurement

  • Innovative whole board scanning uniquely delivers precise measurement of both the board surface and solder deposits.

PCB Stretch and Shrink Management

  • Managed by comparing the board image and Gerber Data, fiducial coordinates and printed material offsets are identified and communicated to upstream and downstream processes supporting closed loop control.


  • Dual laser technology & 4 mega pixel high speed CMOS camera
  • Fastest inspection speed & highest measurement reliability
  • Create 3D Image by generating height profiles for each pixel
  • Obtain 2D & 3D Images by a Single Scan
  • Accuracy assurance of warpage measurement (up to ±5mm)
  • Soft Motion Scanning and Negligible Vibration Effect
  • User Friendly Interface

Dual Laser Projection

Dual laser projection eliminates all shadowing and produces the highest level of measurement accuracy. Using a high frame CMOS camera the system realizes the 3D shape of the entire board scanning area.

The Most Stable Platform

  • Strong X/Y Stage and base frame
  • Lightweight moving parts
  • Most stable and fastest, vibration free motion delivers high accuracy
    and repeatability

Continuous Process Improvement

  • PARMI’s SPI is the Product Innovation Award Winner for 2013 and 2014
  • Intelligent machine design to identify and eliminate paste printing errors.
  • Exclusive “Jet SPI Defect Repair” adds paste to insufficiently filled store. This reduces rework and loss.
  • Unique “Printer Doctor” analyzes inspection data, compares results with paste printing, provides appropriate feedback to the operator and provides trend analysis. Process changes are detected immediately.
  • Process analysis and SPC statistics tools as well as closed-loop interfaces for upstream and downstream processes