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Through Hole Insertion Technology 

Fast, small and highly flexible. Modular platform is the ultimate solution for the automation of through hole insertion process.

Through-hole technology is the mounting process by which component leads are placed into the drilled hole of a bare printed circuit board and soldered to the pads on the opposite side. Through-hole is also the preferred method for applications that require testing and prototyping because it allows for manual replacement and adjustment. Through-hole technology is more expensive than SMT because of its strong mechanical bonds. This is why through-hole technology is reserved mostly for heavier, bulkier components such as semiconductors in large packages or electrolytic capacitors. The technology is also popular for components that require great strength in support, such as electromechanical relays or connectors.

FEATURES

  • High speed, performance & flexibility
  • 6 high-speed mounting grippers
  • Automatic Component Identification & Vision Alignment
  • SmartAITM Pro 3.0 – Intutive Pro Easy Graphical Programming Software & User Interface
  • Component Lead Preforming – Polarity Verification
  • Precision and best performance
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SIMULATIOUS 3 HEAD COMPONENT PICK UP

FLEXIBLE PICKING HEAD SOLUTION

REDUCED VISION INSPECTION TIME

SIMULTANEOUS 3 CAMERA INSPECTION

MECHANICAL & SERVO GRIPPER OPTIONS

TO SUIT EVERY COMPONENT TYPE

   EXPERIENCED IN HANDLING   

 THE MOST CHALLENGING COMPONENTS