X Series

High Speed Inline AXI Platform

High speed inline automated X-ray inspection system for the inspection of PCB-assembly boards for single/multipanels or samples in trays. The system offers market leading inspection speed and is ideal for low-mix high-volume production environment.

3D AOI Sensor Head (TRSC-I)

• 4 Mega Pixel Telecentric Lens Fast Speed CMOS camera
• R.G.B LED 3 Stage Lightings 1
• Extra light (3.8kg), Compact Size ( 3compare to Camera Sensor) • Easy Calibration and Maintenance

Laser Line Scan Method

• Accurate and Stable Measure with Laser Sheet Beam
• Soft Scan Motion by Applying Linear Scale
• Obtain 2D/3D Image to Inspect
• The Fastest Inspection Speed : 65cm 14 × 14μm • Cycle time: For PCB 260mm(L) × 200mm(W)

@10sec (Including Loading & Unloading Time)

X-ray System Features

  • High Speed AXI System for Inline configurations
  • Microfocus X-ray tube (sealed tube / maintenance free)
  • Multiple programmable motion system with linear drives
  • Digital CMOS flatpanel detector
  • Automatic grey-level and geometrical calibration
  • Barcode scanner for serial number and product type selection
  • Full product traceability via customized MES-Interface

Highlights

  • Hardware setup dedicated to PCB inspection
  • High Speed setup for In-line pass through configuration
  • High oblique angle
  • Low dose radiation filter

Inspection Technologies

The modular AXI system concept provides the unique capability to use several inspection technologies in one system. Depending on the specific application request the optimum inspection technique can be selected and/or combined.

2D Transmission

Transmission is two-dimensional image capturing with a fixed detector position

2.5D-Oblique View

AXI on programmable angle-shots up to 40 dgr (used for high performance BGA and PTH inspection)

SFT Slice Filter Technique

High-speed technique using first side image to filter out from double-side image

3D-SART

3D-Tomsynthesis to generate multiple horizontal slices used for high-dense double-sided and multi-chip-modules (MCM,LGA,…)