SVⅡ-K100 Automatic Stencil
Inspection and Measurement System

The SVⅡ-K100 enables high-precision inspection of stencil thickness, deformation, apertures, and PCB pads. It also supports Gerber comparison for accurate validation and provides detailed analysis of squeegee condition.

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HIGH PRECISION INSPECTION
±2μm
Ensures ultra-accurate stencil measurement and consistent inspection results.

FAST INSPECTION SPEED
0.5s / FOV
High-speed inspection performance for efficient SMT production lines.

ADVANCED OPTICAL SYSTEM
Double Telecentric Lens
High-resolution imaging with superior defect detection accuracy.

High-Precision Stencil Inspection for Reliable SMT Production

The SVII-K100 stencil inspection machine enables high-precision inspection of stencil thickness, deformation, apertures, and PCB pads. It also supports Gerber comparison and squeegee inspection for optimal SMT performance.

  • Reduce stencil-related defects
  • Ensure consistent inspection accuracy
  • Enable full traceability
  • Improve SMT process efficiency

Stencil Inspection

Detect aperture defects and contamination.

PCB Pad Inspection

Ensures pad accuracy and positioning.

Squeegee Detection

Identifies deformation and alignment issues.

Gerber Comparison

Validates measurements vs Gerber data.

Thickness & Deformation

Measures stencil and PCB variations.

SIMS Integration

Enables traceability and data control.

OPTICAL SYSTEM

Advanced Optical Inspection

High-resolution imaging for precise defect detection.

MEASUREMENT TECHNOLOGY

Multi-Point Measurement

Ensures accuracy across stencil tension and apertures.

DATA & TRACEABILITY

Smart Data Integration

Enables traceability and process optimization.

Technical Specifications

Repeatability: ±2μm
Inspection Speed: 0.5s / FOV
Lens: Double Telecentric
Resolution: Up to 4.6μm
Max Stencil Size: 736 × 800mm
Power: 220V / 2kW

Why It Matters

Improve Production Quality

Detect defects early and ensure consistency.

Increase Efficiency

Reduce manual work and improve flow.

Faster ROI

Lower defects and operational costs.

HIGH PRECISION INSPECTION
±2μm
Ensures ultra-accurate stencil measurement and consistent inspection results.

FAST INSPECTION SPEED
0.5s / FOV
High-speed inspection performance for efficient SMT production lines.

ADVANCED OPTICAL SYSTEM
Double Telecentric Lens
High-resolution imaging with superior defect detection accuracy.

High-Precision Stencil Inspection for Reliable SMT Production

The SVII-K100 stencil inspection machine enables high-precision inspection of stencil thickness, deformation, apertures, and PCB pads. It also supports Gerber comparison and squeegee inspection to ensure accurate validation and optimal SMT process performance.

  • Reduce stencil-related defects and printing issues
  • Ensures consistent inspection accuracy across production lines
  • Enables full traceability with integrated data systems
  • Improves overall SMT process efficiency

Stencil Inspection

Detect aperture defects, contamination, and dimensional variations.

PCB Pad Inspection

Ensures pad size accuracy and positioning for reliable soldering.

Squeegee Detection

Identifies deformation, parallelism, and gap issues.

Gerber Comparison

Compares real measurements vs Gerber data for validation.

Thickness & Deformation

Measures stencil thickness and PCB deformation accurately.

SIMS Integration

Enables full traceability and smart data management.

OPTICAL SYSTEM

Advanced Optical Inspection

Equipped with a double telecentric lens and advanced lighting system, the SVII-K100 delivers high-resolution imaging for precise detection of stencil defects and contamination.

MEASUREMENT TECHNOLOGY

Multi-Point Measurement System

Performs multi-point inspection of stencil tension, aperture size, alignment, and thickness to ensure consistent quality across the stencil surface.

DATA & TRACEABILITY

Smart Data Integration (SIMS)

Enables full traceability, real-time monitoring, and data-driven process optimization for improved manufacturing performance.

Technical Specifications

Repeatability ±2μm
Location Accuracy ±3μm
Inspection Speed 0.5s / FOV
Lens Double Telecentric Lens
Optical Resolution Up to 4.6μm
Lighting Top red coaxial + bottom white LED
Max Stencil Size 736mm × 800mm
Inspection Area 500 × 550mm
Operating System Windows 10 (64-bit)
Data & SPC SPC, Cp/Cpk
Power 220V / 2kW
Machine Size 1130 × 1215 × 1500 mm
Weight 830 kg

Why It Matters

Improve Production Quality

Detect defects early and ensure consistent performance.

Increase Efficiency

Reduce manual work and improve production flow.

Faster ROI

Lower defects and operational costs.