VSP300

Inline 3D SPI

Fast Programming Without the need of Gerber File. Suitable for 3D Solder Paste Inspection after SMT screen printing.
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Product Features 

  • Intelligent zero reference point technology ensure accurate height measurement.
  • Effective at detecting solder bridging, solder breakage, icicle, etc.
  • Effective in detecting PCB with different color variations.
  • Automatic compensation for solder pad improves the accuracy of both solder paste height and volume measurement.
  • SPC data analysis helps to improve process quality.
  • Three Point Checks software helps to quickly detect the root cause of excess, lack of solder paste and smearing.

Optical Imaging Principle

By means of phase shift projection, the information of the height of the object with diffuse reflection can be well restored.

  Easy and fast programming  

  Cross Section Analysis Function