Icon Series

3D Solder Paste Inspection

High accuracy: Intelligent zero reference point technology ensures accurate measurement, especially for PCB board deformation.
High performance: Perfect combination of 3D and Color-featured algorithm ensures effective detection on solder bridging, solder breakage, icicle, etc.
High speed: Flexible choices of multiple optical options, with industry-leading inspection speed and performance.
Strong Anti-jamming: Effective in detecting PCB with different colors variations.
Automatically adiust inspection specifications for black and white boards.
Fast programming can be achieved with/without Gerber.
Process optimization: SPC data analysis hells to improve process quality.

Benefits Of Using 3D AOI

Component positioning is accurate, and false call.
High detection coverage can detect Insufficient, Open solder, IC pin lifted, component side lifted and damage.
Accurately report and define the real defect type. Better for quality control analysis.
Easy to program and debug, not require high experience engineer.