Pressure sintering is now considered the most reliable technology for power electronics packaging. The proven advantages of sintering technology are the following ones:

  • Highest melting temperature >400°C
  • Best thermal conductivity coefficient >150 W/(m K)
  • Best electrical conductivity coefficient
  • Best result on lifetime testing

Sintering is a consolidate bonding solutions to sinter dies and clips on DBC, DBA, AMB, frames and moreover, to sinter package on heatsink. AMX worldwide patented a unique sintering tool for its sintering press, the so called “Micro-Punch”, grants an even pressure, it can adapt itself to every DBC size and configuration, and can press independently the thinnest and smallest dies even if they are very close one another.

X-SINTER P200X Series

AMX Pressure sintering technology

New patented concept for sintering press which greatly reduces maintenance and production stops. It guarantees flexibility and accuracy during the production process. X Sintering P200X measures the total force applied on every substrate. Easy removable pressing tool to handle production variation and avoid long downtimes.
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