VS7000
Inline 3D AOI
3D technology to locate the component body, and use color to locate the pad
- Not affect by silk screen and incoming material colors.
- Effectively solve the detection problem of blackboard black component.
- Big data statistics and color extraction assistance, which can effectively deal with white, red and black board.
- FOV pre-processing prevent “icicle” phenomenon of the zero reference and prevent high false call.
- The inspection of offset, etc are compliance with the IPC standard.
- Accurately report NG type such as billboard, tombstone etc.
- Open soldering and insufficient soldering happen without lead lifted can also be detected.
3D Shadow Free Moiré Technology
When the line is projected on the surface of the object with different heights, the line projected imaging will be dislocated. Based on this principle, the height of the object can be calculated.
Phase shift projection can capture the height of diffuse objects like components. Easy to detect floating, offset, damages, etc.
Principle Of RGB Light Technology
AOI is to display 3D information of solder joints through 2D images. According to the different shapes of the solder joints, different light colors is reflected into the camera, and the defect is judged by extracting the image information of the feature points and combining with the algorithm.
Flatness Calculation Algorithm
Effective detection of IC pin floating regardless of incoming pin height changes. Using the flatness algorithm, the pin floating can be effectively detected by using the range. Reduce false call due to incoming pin height differences.
Intelligent Zero Reference Point Technology
3D Positioning Technology
Benefits Of Using 3D AOI
- Component positioning is accurate, and false call.
- High detection coverage can detect Insufficient, Open solder, IC pin lifted, component side lifted and damage.
- Accurately report and define the real defect type. Better for quality control analysis.
- Easy to program and debug, not require high experience engineer.