CUBE SERIES

SMT INLINE 3D AOI

3D AOI – Cube Series it ideal for high-speed, high-precision inspections of SMT components in SMT pre-reflow and post-reflow process. Eliminates shadow blind spots and accurately captures 3D component shapes for optimal results.
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  •   Rich algorithm, the combination of 3D, Al and color feature algorithms to optimize the detection rate of the defects.
  •   Multiple positioning methods to locate the component precisely. Intelligently compensate for board warpage and detect defects on black components on black board.
  •   Adapts to different color PCBs, effectively detect both black and white boards.
  •   Marble platform, dual-drive plus motion control card ensure industry-leading inspection speed.
  •   Ultra-high range 3D reconstruction technology, capable of measuring components up to 35mm height.
  •   The powerful combination of three-point check software and SPC data analysis quickly identifies the root cause of defects.

SMT LINE

OPTICAL IMAGING PRINCIPLE

CORE TECHNOLOGY AND ADVANTAGES