Through-hole technology is the mounting process by which component leads are placed into the drilled hole of a bare printed circuit board and soldered to the pads on the opposite side. Through-hole is also the preferred method for applications that require testing and prototyping because it allows for manual replacement and adjustment. Through-hole technology is more expensive than SMT because of its strong mechanical bonds. This is why through-hole technology is reserved mostly for heavier, bulkier components such as semiconductors in large packages or electrolytic capacitors. The technology is also popular for components that require great strength in support, such as electromechanical relays or connectors.
- High speed, performance & flexibility
- 6 high-speed mounting grippers
- Automatic Component Identification & Vision Alignment
- SmartAITM Pro 3.0 – Intutive Pro Easy Graphical Programming Software & User Interface
- Component Lead Preforming – Polarity Verification
- Precision and best performance
SIMULATIOUS 3 HEAD COMPONENT PICK UP
FLEXIBLE PICKING HEAD SOLUTION
REDUCED VISION INSPECTION TIME
SIMULTANEOUS 3 CAMERA INSPECTION
MECHANICAL & SERVO GRIPPER OPTIONS
TO SUIT EVERY COMPONENT TYPE
EXPERIENCED IN HANDLING
THE MOST CHALLENGING COMPONENTS
Using a high-resolution CCD camera and GAR user-friendly Windows-based software allows users to program the routing paths in minutes. There are also no limitations in the number of programs stored. GAR1200 uses high-quality components and a welded steel structure to ensure rigidity and high performance. All the axes and linear guides used are protected from dust and dirt to increase lifespan and performance.