| In This Issue |
| Overview of PARMI SPI |
| PCB Shrink measurement |
| PCB Warpage measurement |
| Closed loop feedback to printer |
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Process control by SPI |
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SPI is dedicated to detecting and filtering the print problems in the printing process, and providing accurate print information feedback and intelligence to improve and stabilise the printing process.
Most SPI systems in the market are restricted to the detection of defect pads only, but this alone cannot maximize the uses of SPI for ROI. PARMI differs from the competition: not only does it ensure perfect defects detection, but it also provides the functions for process innovation to remove the original causes of defects in the printing process. |
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| Quiptech, Gold Sponsor of IPC Budapest |
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| Overview of PARMI SPI systems |
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In-line HS60 SPI: is now PARMI’s highest running machine. Over one thousand HS60 systems have been installed world-wide to very satisfied customers since 2008.
PARMI offers various models in SPI HS60 series - SPI HS60, SPI HS60L, SPI HS60XL, SPI HS60XXL, etc. depending on panel size and the needs of customers.
In-line HS70 SPI: is our next generation SPI system which is even faster and more accurate than the HS60 model. The HS70 was developed as a higher speed solution at the request of our high volume customers. This system has been very well received by the customers who are the most advanced niche of SMT technology.
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| Dual Lane HS70D SPI: At the request of our customers we have developed the most successful dual lane SPI in the market. This model delivers the exact same speed and accuracy as the single lane model. It is also designed to be flexible through its movable rails 2, 3 and 4. Over 100 sets of our Dual Lane HS-70D have been installed since 2010 which makes PARMI the most experienced dual lane system in the market. |
| PCB Shrink measurement |
One principal differentiating function of PARMI to competitors, apart from measurement accuracy, is PARMI’s capacity to measure, graph and provide trend analyses for PCB shrink. PCB shrinkage directly affects the printing and chip mounting processes. The PARMI SPI system can substantially reduce the defect rate in these areas by management of PCB shrink. |
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| It is probably impossible to correctly print paste to the middle of the pad area if the Panel or Stencil mask is shrunk, even though the arrangement of the stencil mask or panel inside the printer is set perfectly. The PARMI SPI system shows the panel shrink and extension conditions by comparing the image with the gerber data using fiducial coordinates. The panel shrink and extension conditions are compared to the printed solder paste position and informed to the user. Therefore, the user is able to manage PCB movements, and correct the position of apertures when designing stencils by comparing the image with the gerber data using fiducial |
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| coordinates. The panel shrink and extension conditions are compared to the printed solder paste position and informed to the user. Therefore, the user is able to manage PCB movements, and correct the position of apertures when designing stencils. |
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| PCB Warpage measurement |
The Real-time warp tracking function is PARMI’s own original proprietary technological integration. It is based on two kinds of outstanding measuring competence:
- Firstly, the PARMI system can measure up to 10mm warp;
- Secondly, it guarantees measurement accuracy of solder paste on badly warped boards. |
| With laser technology we always measure from the actual surface of the PCB as reference. The laser head moves up and down relative to board warp and the triangulation method accurately measures the real volume, area and height of the solder deposit taking the PCB surface closest to the pad into consideration. |
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| On other Moire type systems that do not have Z axis motion, the distance set from camera to PCB is always the same. Therefore if there is a downward or upward warp the Moire camera loses focus because it does not move up or down to refocus on the pad. The image is actually distorted and the measurement is inaccurate. In addition the Moire white light system which measures shadow length will see and measure shorter or longer shadows due to warped boards thus adding to the inaccuracy of the data. This is why the PARMI Z-Axis motion control produces the most accurate measuring results even on warped boards. PARMI also does it in real time without making a pre-scan. |
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Close loop feedback to printer |
| Lastly, PARMI's smart correction algorithm gives feedback after measuring the X, Y offset and rotation angle contrasted with the panel. PARMI SPI automatically communicates rotation offset and positioning offset between the panel and the stencil back to the screen printer so that the screen printer can auto adjust based on PARMI's accurate and reliable information. |
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| Generally, the actual solder paste deposition after printing has dozens of um of offset. This can be due to the squeegee direction for example. Or it can also be due to a solder paste offset and rotation offset caused by a discordance between camera coordinates for fiducial marks inside the printer, and coordinates for the panel or mask correction. Now PARMI’s smart correction algorithm will give feedback to the screen printer after measuring the X, Y offset and rotation angle contrasted with panel. This feedback of only a few um’s will guarantee the performance of the screen printer |
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| About PARMI |
PARMI’s Global Market Share has increased sharply in recent years. This is largely because our technology is designed and developed in-house. We own and develop all engineering relevant to the machine. This, combined with our know-how of the printing process allows us to be flexible in customization with quick response to our customer’s ever changing needs and requirements |
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| Learn More About Process control by SPI - Solder Paste Inspection |
| Quiptech are your PARMI representative partners if you require additional information on this Process control by SPI please email info@quiptech.com
For further information on PARMI,
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