The 4000Plus hot bump pull application is achieved by selecting a specialized load cartridge which can be programmed to apply a time-temperature reflow profile to individual solder bumps and/or bonds using a test probe.
Reflow parameters including pre-heating, soak, rate of rise, time above liquidous as well as cooling rate are integrated into the 4000Plus Paragon™ software for easy on-screen profiling and control. A selection of standard probe sizes are offered as well as custom test tips which are available upon request. |
