Bond Testing-Nordson Dage info@quiptech.com  
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Pad Cratering Inspection
DAGE : Leaders in Hot Bump Pull Technology
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  Pad cratering has become a major issue with lead-free assemblies and the development of the IPC-9708 standard together with the availability of the 4000Plus hot bump pull test methodology enables product developers to determine the optimum materials for their applications.   Pad cratering
Hot Bump Pull Application Hot Bump Pull Application

The 4000Plus hot bump pull application is achieved by selecting a specialized load cartridge which can be programmed to apply a time-temperature reflow profile to individual solder bumps and/or bonds using a test probe.

Reflow parameters including pre-heating, soak, rate of rise, time above liquidous as well as cooling rate are integrated into the 4000Plus Paragon™ software for easy on-screen profiling and control. A selection of standard probe sizes are offered as well as custom test tips which are available upon request. 

About Nordson Dage

Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries.Visit Nordson Dage at Productronica Stand A2.339 on November 15-18 in Munich.

Evaluate Cratering Inspection Technolog
Quiptech are your Dage representative partners and operate a full Applications & Demonstrations facility in Budapest.  We are currently taking bookings from SMT manufacturers to review the technology there. 


Email us today to book your place.


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